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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done ...