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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Convective Heat Transfer Distribution on the Surface of an Electronic Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Measurements of the distribution of convective heat transfer over the five exposed faces of a low profile electronic package are described. The package, of square planform and length-to-height ...