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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-8 of 8
Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN on SiC Semiconductor Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ...
Special Section on InterPACK 2015
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: InterPACK 2015, the flagship conference of the ASME Electronic and Photonic Packaging Division held on July 6–9, 2015 in San Francisco, CA, is the premier international forum for the exchange of stateoftheart knowledge ...
Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on ...
Enhanced Heat Transfer Using Microporous Copper Inverse Opals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels ...
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler offers lower pressure drop and increased heat removal capability (>1 kW/cm2) for microprocessors and power electronics cooling using ...