Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Ever since the discovery of the “popcorn” failure of plastic-encapsulated integrated-circuit (IC) packages in the 1980s, much effort has been devoted to understanding the failure mechanism and ...