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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio (FR) can however ...
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study is focused on the experimental characterization of two-phase heat transfer performance and pressure drops within an ultracompact heat exchanger (UCHE) suitable for electronics cooling applications. In this ...