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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Board-level thermomechanical fatigue lifetimes of five different wafer-level chip scale packages (WCSPs) with lead-free solder joints were studied by both experiment and finite element method ...