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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We study stresses and fracture due to temperature change in a flip-chip assembly at the chip/underfill interface for various thermo-mechanical properties of underfill and the device’s geometry. ...