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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the use of the double cantilever beam (DCB) method for characterizing the adhesion strength of interfaces in advanced microelectronic packages at room and high temperatures. Those interfaces include ...
Characterization of Bulk and Thin Film Fracture in Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As semiconductor packaging technologies continue to scale, it drives the use of existing and new materials in thin layer form factors. Increasing packaging complexity implies that materials in thin layers are subject to ...