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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Solving Thermal Issues in a Three Dimensional Stacked Quad Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through Silicon Vias
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electronics industry is heading toward the threedimensional (3D) microprocessor to cope with higher computing workloads. The 3D stacking of the processor and the memory components reduces the communication delay in ...