Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-7 of 7
A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wire bond connections are susceptible to fatigue failure as a result of various thermo-mechanical damage mechanisms during the component operation life. Because of uncertainties arising from the ...
A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fracture of glass seals in metallic hermetic electronic packaging is a significant failure mode because it may lead to moisture ingress and also to loss of load carrying capacity of the glass ...
Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study is motivated by the urgent need in the electronics industry for mechanical properties and durability of Pb-free solders because the use of Pb will be banned in the EU by July 1, ...
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the ban of the Pb use in electronics products is approaching due to the waste electrical and electronic equipment (WEEE) and restriction of hazardous substances (ROHS) directives, electronics ...
Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study examines damage initiation and propagation in solder joints with voids, under thermomechanical cyclic loading. An accelerated thermal cycling test is conducted on printed wiring assemblies ...
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of process-induced voids on the durability of Sn–Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ...