Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional finite element analysis has been applied for determining time-dependent solder joint response of leaded surface mount components under thermal cycling. Two main challenges are the ...