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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Lifetime Prediction of Solder Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fatigue lifetimes of lead-low tin solders have been investigated. Results indicate that the Coffin-Manson law does not necessarily fit experimental data. The phenomenon can be correlated with a ...
Micromechanical Method to Predict Fatigue Life of Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fatigue lifetimes of low-tin high-lead and tin-lead eutectic solders under total strain controlled tension-tension tests were studied in this paper. Based on the stress and strain micro-macro ...
Characterizing the Failure Envelope of a Conductive Adhesive
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper focuses on mechanical testing designed to determine the static failure envelope for a conductive adhesive. Samples were made by bonding copper pegs together with the conductive adhesive. ...