Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with ...