Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Moiré Interferometry Analysis of Laser Weld Induced Thermal Strain
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental method is presented to study laser weld induced thermal strain using digital image analysis enhanced moiré interferometry. A phenomenon that occurs in the assembly of optical ...
In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Development of the residual stresses in an organic adhesive, alumina filled epoxy (EPO-TEK H65-175MP) during curing process has been studied in-situ. The effect of the adhesive’s thickness was ...
Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moiré Interferometry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fractional Fringe Moiré Interferometry (FFMI)—a new experimental methodology to measure accurately deformations and consequently strains—has been successfully implemented to determine thermally induced ...