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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Effects of Substrate Conductivity on Convective Cooling of Electronic Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The coupled conduction and forced convection transport from substrate-mounted modules in a channel is numerically investigated to identify the effects of the substrate conductivity. The results ...
Natural Convection Air Cooling of a Discrete Heat Source on a Conducting Board in a Shallow Horizontal Enclosure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experiments were performed to measure the heat transfer coefficient on the surface of a square flush heat source mounted at the center of an FR-4 plate in a small horizontal enclosure. The ...