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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Stress Analysis and Thermal Characterization of a High Pin Count PQFP
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A three-dimensional finite element model of a high pin count plastic-quad-flat-pack (PQFP) has been developed by using ANSYS™ finite element simulation code [1]. The model has been used for ...
Optimization of Extruded Type External Heat Sink for Multichip Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A three-dimensional finite element model of a multichip module (MCM) has been developed by using ANSYS™ finite element simulation code. The model has been used for thermal characterization of ...