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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joints of leadless surface mounted components, which were thermally cycled, were studied to determine their failure mode and to compare the results with work done on bulk solder specimens. ...
Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For lead/tin solders, room temperature is hot enough that deformation is controlled by creep. Creep deformation is thermally activated and is a function of time. Therefore, the appropriate ...