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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Exact series solutions for three-dimensional temperature distribution in two-layer bodies subject to various types of boundary conditions are presented. Special consideration is given to the case ...
Holographic Interferometry Using Self-Developing Optical Crystals for Heat Flux Evaluation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Double-exposure holographic interferometry with crystals of iron-doped lithium niobate as the storage material is applied to study heat transfer from electronic chips. These crystals are self-developing, ...
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microprocessors continue to grow in capabilities, complexity, and performance. Microprocessors typically integrate functional components such as logic and level two cache memory in their architecture. ...