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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental ...
Natural Convection in an Enclosure With Discrete Heat Sources on the Vertical Walls
Publisher: The American Society of Mechanical Engineers (ASME)
An Interfacing Software Package for Thermal Analysis: Application to Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A software package called: INterfacing Software for Thermal ANalysis (INSTAN) is developed to interface finite element general purpose programs with finite-difference thermal network analyzers for ...
Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Parametric studies are performed on heat transfer in surface-mounted components of conduction cooled Standard Electronic Modules (SEMs). Thermal network models are developed for the various components ...