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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Numerical Simulation of Conjugate Heat Transfer in an Electronic Package Formed by Embedded Discrete Heat Sources in Contact With a Porous Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A physical/mathematical model has been developed to simulate the conjugate heat transfer in an actively cooled electronic package. The package consists of a highly conductive substrate with ...