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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-6 of 6
Finite Element Method for Predicting Equilibrium Shapes of Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the development and application of a finite element method for determining the equilibrium shapes of solder joints which are formed during a surface mount reflow process. ...
Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the application of the parametric finite element method for predicting shapes of three-dimensional solder joints. With this method, the surface of the joint is meshed ...
Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation ...
Solder Joint Formation in Surface Mount Technology—Part I: Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model of solder joint formation during a surface mount reflow process is developed in the present paper, and the solution is obtained in an explicit integral form. For two ...
Solder Joint Formation in Surface Mount Technology—Part II: Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper dimensionless design curves relating fillet height and length to joint cross-sectional area are presented for surface-mount solder joints. Based on an analytical surface tension ...
Effect of Chip and Pad Geometry on Solder Joint Formation in SMT
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model of solder joint formation during a surface mount reflow process is developed for two-dimensional fillets whose flow may be restricted due to “finite” metallizations on a ...