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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We report the first use of a bimetallic buckling disk as a thermal conduction switch. The disk is used to passively alter the thermal resistance of the package of a chip scale atomic clock. ...
Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The power dissipation for chip-scale atomic clocks (CSAC) is one of the major design considerations. 12 mW of the 30 mW power budget is for temperature control of the vertical-cavity-surface-emitting ...