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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Delamination of interfaces in integrated circuit (IC) packages gives rise to electrical and mechanical failures such as popcorn cracking. Hence it is important to be able to analyze the mechanics ...