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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile ...