Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plastic encapsulated devices are of great interest against their ceramic or metallic counterparts, as they permit significant cost reductions. However, they are more sensitive to moisture ingress, ...