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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For micro-electronic components and systems, reliability under thermomechanical stress is of critical importance. Experimental characterization of hotspots and temperature gradients, which can lead to deformation in the ...