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contributor authorN. J. Nigro
contributor authorF. J. Zhou
contributor authorS. M. Heinrich
contributor authorA. F. Elkouh
contributor authorR. A. Fournelle
contributor authorP. S. Lee
date accessioned2017-05-08T23:49:49Z
date available2017-05-08T23:49:49Z
date copyrightSeptember, 1996
date issued1996
identifier issn1528-9044
identifier otherJEPAE4-26155#142_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/116775
description abstractThis paper discusses the application of the parametric finite element method for predicting shapes of three-dimensional solder joints. With this method, the surface of the joint is meshed (discretized) with finite elements. The spatial variables (x, y, z) are expanded over each element in terms of products of interpolation (blending) functions expressed in parametric form and element nodal coordinates. The element nodal coordinates which are not constrained by the boundary conditions are determined by minimizing the potential energy function which governs the joint formation problem. This method has been employed successfully in the past to predict the shapes of two dimensional fillet and axisymmetric joints. In this paper, the method is extended to three dimensional problems involving sessile drops formed on a rectangular pad and solder columns formed between two horizontal planes and subject to a vertical force.
publisherThe American Society of Mechanical Engineers (ASME)
titleParametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints
typeJournal Paper
journal volume118
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2792144
journal fristpage142
journal lastpage147
identifier eissn1043-7398
keywordsFinite element methods
keywordsShapes AND Solder joints
treeJournal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003
contenttypeFulltext


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