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    Thermal Cycling Damage of Metal Matrix Composites: Analytical Study on Dimensional Change 

    Source: Applied Mechanics Reviews:;1993:;volume( 046 ):;issue: 005:;page 201
    Author(s): Minoru Taya; William D. Armstrong; Marty Dunn
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An analytical model to predict dimensional changes in thermal cycled metal matrix composites (MMCs) with and without constant stress is proposed. The present model assumes that the temperature-time ...
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    Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 002:;page 208
    Author(s): Qiang Xiao; Harold J. Bailey; William D. Armstrong
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Relationships between microstructural and mechanical aging effects in eutectic PbSn and Pb-free solder alloy Sn3.9Ag0.6Cu are reported and compared. The room temperature aged Sn3.9Ag0.6Cu alloy ...
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